ADHESIVES FOR SMD CHIP COMPONENT
回中文
SA-33P-2
TECHNICAL DATA SHEET
 |
 |
|---|---|
| < 35g Syringe > | < 300g Cartridge > |
ASAHI CHEMICAL RESEARCH LABORATORY CO.,LTD
UTSUKI PLANT
656 UTSUKI-CHO, HACHIOJI-CITY,
ELECTRONICS TRADING & MFG CO., LTD.
TEL：(852) 22320623/23140038 FAX：(852) 23140048
Web Site: www.electronics-trading.com E-mail: smt@electronics-trading.com
ADEHESIVE SA-33P-2
This product is one component type, thermosetting epoxy adhesives
designed for fix chip components tentatively on the PCB.
MAJOR FEATURES
1) High adhesion strength prevent from falling off the chip component in
soldering process.
2) Epoxy resin used in this product keeps high insulation resistance.
3) Excellent application property due to appropriate rheology.
USAGE AND PRECAUTION FOR HANDLING
1) Application ：Most suitable for Dispenser application.
2) Curing ：Standard curing conditions are 130ºC - 60 second.
Since curing, however, vary with curing system (far infrared,
circulating heat oven and etc.), please fix curing conditions
after repeated test with your curing system.
3) Shelf life is 3 months in storage of room temperature. In order to keep
long stability, please store in a refrigerator below 10ºC.
PACKAGE UNIT
Standard package unit is a Tube of
If special packaging is needed, please
contact us : smt@electronics-trading.com
BASIC CHARACTERISTICS OF PASTE AND
CURED ADHESIVES
|
Items |
SA-33P-2 |
Test Method |
|
Appearance |
Red Color Paste |
Visual Inspection |
|
Main Ingredient |
Epoxy Resin |
|
|
Viscosity at 30ºC |
950 Pa/S |
Viscotester VT-04 |
|
Thixotropy Index at 30ºC |
20 |
Brook Field HBT type |
|
Specific Gravity at 25ºC |
1.20 |
Picno meter method |
|
Standard Curing Condition |
130ºC x 60 sec |
Far Infrared oven |
|
Shelf Life |
6 months after manufactured |
Stored in a refrigerator below 10ºC |
|
Adhesive Strength |
50N/pc. |
2125 chip |
|
Resistance to Molten
Solder |
20 sec |
Dip in 260ºC solder |
|
Tg point |
110ºC |
TMA method |
|
Coefficient of Liner
Thermal Expansion |
5 x 10-5 |
TMA |
|
Tensile Adhesive Strength |
12ＭＰa |
JIS K 6850 |
|
Volume Resistivity |
2.0 x 1015Ω |
JIS K 6911 |
|
Dielectric Constant(1MHz) |
JIS K 6911 |
|
|
Dielectric Loss Tangent |
JIS K 6911 |
The above information is obtained by experiment in our lab. And does not
imply assured figures.
CHARACTERISTICS of PASTE
a.
 |
Viscosity vs Temperature
b. Thixotropy Ratio vs Temperature
c. Storage Stability
CURING PROPERTIES
a. Curing Temperature vs Curing Time
b. Curing Condition vs Adhesion Strength
c. Application Condition by Dispenser
For Example of Adhesion strength with 2125 chip resistor (Glass Epoxy Substrate)
|
ITEMS |
CONDITION |
|
Temperature |
30ºC |
|
Application Pressure |
0.2MPa |
|
Application Time |
0.03 sec. |
|
Nozzle Diameter |
|
|
Tact Time |
0.12 sec. |
|
Curing Condition |
130ºC x 60sec. |
|
Adhesive Strength |
> 40N |
ｄ．Adhesion
Strength on each Chip Device
|
Name of Chip |
Adhesion Strength( N ) |
|
2125 condenser |
> 30 |
|
2125 Resistor |
> 40 |
|
Mini-Mold IC |
> 30 |
|
Glass Diode |
> 20 |
ELECTRONICS TRADING & MFG CO., LTD.
TEL：(852)
22320623/23140038
FAX：(852) 23140048
Web Site: www.electronics-trading.com E-mail: smt@electronics-trading.com